CVE-2023-33063

What is affected

Vendor	Qualcomm
Product	Multiple Chipsets
Weakness	CWE-416

The vulnerability

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Required action

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

US federal civilian agencies were required to act by 26 December 2023 under BOD 22-01. The deadline is a compliance date, not a measure of severity — it says nothing about how dangerous the flaw is to anyone else.

Where this comes from

Every field on this page is taken from the CISA Known Exploited Vulnerabilities catalog, last synced 13 Nov 2026, 00:30. Nothing here is our own assessment. For the technical scoring, see the NVD record below.

NVD record ↗ CVE.org record ↗